INVITATION
PACK EXPO INTERNATIONAL 2018
Techik Instrument (Shanghai) Co., Ltd will attend the PACK EXPO INTERNATIONAL 2018, Oct. 14-17, Chicago, IL USA.
We are looking forward to your visit and test the machine in person.
Your satisfaction is our top concern.
Techik Booth No.:E-9423
Date:14-17 October 2018
MCCORMICK PLACE ,CHICAGO, IL USA